Integrated System Circuit Design Chip Testing (ICtest) Categories

ICtest categories include.

Chip Testing.

Chip Test

Package Test

Wafertest is the testing of wafers after they have been developed from fab production and before they are cut and thinned.

The device is usually customized by the test manufacturer or is usually a wafer on a test platform with probes to predetermined test points on the chip. The probes can pass DC currents and AC signals and can test a variety of electrical parameters.

For optical integrated circuits, it is also necessary to test its electrical properties under the given light conditions.

1. wafer test

Main equipment: probe platform, auxiliary equipment: clean room and its full set of equipment.

Wafer testing is the most efficient test, because there are often hundreds to thousands or even tens of thousands of chips on a wafer, and all of them can be tested at once on the test platform.

Wafer pin test (Chip Probing; CP) is aimed at the Chinese chip for the electrical function of the test (Test), so that the IC into the assembly before the first filter out the electrical function of the chip produces bad, in order to avoid the increase in the cost of defective products to the enterprise manufacturing technology.

In the semiconductor process, the pin test process can share the same tester with the test process, and only need to replace the tester with different test components. Therefore,wafer level testing in order to improve the utilization rate of the tester, the general test house in addition to providing the final test services, but also accept chip test orders.

2.chiptest

Chip test (Chiptest) is the wafer cutting and thinning into a separate chip after the test. Its equipment is usually developed, manufactured or customized by the test manufacturer. Generally, the wafer is placed on the test platform, and a probe is used to detect the intended test point in the chip. The probe can test a variety of electrical parameters via DC current and AC signals.

The main difference between chip test and wafer test equipment z is the size and shape of the object to be tested and therefore the fixture. For optical integrated circuits, it is necessary to test their electrical properties under certain lighting conditions.

Chiptest main equipment: probe platform (including clamping fixtures for different specifications of chips) chip test auxiliary equipment: clean room and its complete sets of equipment.

Chiptest can test the scope and wafertest is almost the same, because our country has gone through a cutting, thinning process, but also cutting, thinning process in the damaged defective products picked out. But the efficiency of chiptest is quite lower than wafertest.

3. packagetest

Packaging test is the chip package into a finished product after the test. Because the chip has been packaged, so there is no longer a need for clean room environment, test requirements greatly reduced conditions.

Typically, packagetest equipment is also developed or customized by individual manufacturers and often includes sensors for testing various electronic or optical parameters. Often, however, probes are not used to probe into the chip (most chips cannot be probed after packaging), but are tested directly from the pin connections.

Because package testing cannot use probes to test the inside of the chip, it is limited in scope and many metrics cannot be tested in this section. However, package test is a test of the final product Z, so its passing test is the final qualified product.

IC testing is a rather complex systematic project and cannot simply tell you how to judge pass or fail.

Generally speaking, is based on the teaching design development requirements for students to analyze the test, does not meet the technical requirements of the design is unqualified. The design requirements,failure analysis due to the product has a different and different, some IC need to test a large number of parameters, some only need to test a very small number of parameters.

In fact, a particular IC does not need to pass all the tests mentioned above, and an IC needs to pass multiple test procedures, especially to test which parameters in which process, there are also many variations, which is a complex system engineering.

For example, for large chip area, high yield, low packaging costs of the chip, usually do not need wafertest, while for small chip area, low yield, high packaging costs of the chip, Z is good to put a lot of tests in the wafertest link, early detection of defective products, to avoid defective products mixed into the packaging process, unnecessarily increasing the cost of packaging.

IC test equipment, due to the production of integrated circuits is usually very large, so the multimeter, oscilloscope and other manual testing together with absolutely incompetent, the current test equipment is usually fully automated, multi-functional combination of measurement equipment, and controlled by the program, basically can be considered that these test equipment is a measurement of a special industrial robots.

IC test is a very important part of the IC production process. In most current integrated circuits, the cost of test often accounts for 1/4 to half of the total cost.