Multi-layer PCB design, how do engineers define the stack?

Multi-layer PCB design, how do engineers define the stack?

Multi-layer PCB design is becoming more and more becoming common in modern enterprise electronics. This kind of teaching design information technology personnel can provide learning more functions and connections in a limited area, while constantly improving the performance and reliability of the working circuit. However, before conducting a multilayer PCB design study, engineers we need to more accurately define the structure and function of each layer. In this article, we will explore how engineers can define the stacked layers by defining them in a multilayer pcb fabrication design.

Layer 1: The Contact Layer

The first layer is usually the contact layer that connects to the outside world. It includes pins or connections to other devices or external connectors. Engineers need to design this layer according to circuit requirements and external interfaces to ensure proper signaling and connectivity functions.

Layer 2: Power Layer

The power supply layer is used to provide the power required by the circuit. In PCB factory, there are usually multiple power supply layers. Engineers need to determine the location of each power supply layer to prevent current disturbances or unexpected electromagnetic interference.

Layer 3: Signal Layer

The signal layer is used to transmit and process signals in a circuit. Engineers need to determine the location and layout of multiple signal layers in a design to ensure optimal signal transmission and minimal crosstalk.

Layer 4: Ground Layer

The ground layer is usually located above or below the signal layer and is used for grounding and shielding. It provides stable grounding and helps to minimize electromagnetic interference.

Other Layers: Data Layer, Shield Layer, etc.

Depending on the needs of the circuit, other layers such as data layer, shielding layer, etc. may be added. The location and function of these layers will be defined based on specific design requirements.

In a multi-layer PCB design, engineers need to carefully define the structure and function of each layer to ensure proper operation and performance optimization of the circuit. The definition of each layer, from the contact layer to the power layer, signal layer, ground layer, etc., can help engineers draw a complete multilayer PCB design solution and ultimately achieve the design goals.


Related Hot Topic

What is the fabrication process for PCBs?

The process of transferring a circuit board design to the physical structure of the board is known as PCB fabrication. Contrarily, PCB assembly is the process of adding components to the board in order to make it work.

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